Show cover of 3D InCites Podcast

3D InCites Podcast

As a semiconductor industry community, 3D InCites brings to life the people, the personalities, and the minds behind heterogeneous integration and related technologies in a uniquely personal way. The goal is to inform key decision-makers about progress in technology development, design, standards, infrastructure, and implementation.The 3D InCites Podcast provides a forum for our community members to discuss all kinds of topics that are important to running a business in the semiconductor industry, from marketing to market trends, important issues that impact our industry, and our success stories.


A Conversation With SEMI'S Market Intelligence Team About the World Fab Forecast
This SEMI Market intelligence Report podcast features Sanjay Malhotra, Vice President of SEMI’s Corporate Marketing and the Market Intelligence Team (MIT), and Christian Dieseldorff, Senior Principal Analyst. The conversation focuses on the World Fab Forecast, its history, how data is gathered, and how semiconductor manufacturers and suppliers use it to guide their business decisions. Sanjay starts things off by recapping the Market Symposium at SEMICON West, and the midyear forecast presented there. He also shares how he used the World Fab Forecast during his years in the industry. Christian talks about the outlook for new fabs and fab expansions, and how much this activity represents future capacity increases from both an actual and historical standpoint. Most importantly, he and Sanjay put fab expansion numbers and capacity into context. Lastly, Christian talks about the impact of the US CHIPS and Science Act, and other global incentives around the world. He and Sanjay provide some valuable insights to consider when reviewing the World Fab Forecast to help listeners make the most of this useful tool. You can learn more about SEMI Market Reports here.  For specific questions, email the Market Intelligence team at Find our Guests on LinkedIn: Sanjay Malhotra, VP of Corporate Marketing and the MITChristian Dieseldorff, Senior Principal Analyst, MITSEMI A global association, SEMI represents the entire electronics manufacturing and design supply chain.
31:53 09/22/2022
A Conversation about The Advantages of Collaboration between the Mexico and the US for Semiconductor Manufacturing
In this episode, Françoise speaks with Dr. Juan Terrazas, the Director of the College of Engineering at CETYS University about the benefits of cross-border manufacturing relationships between the US and Mexico to help alleviate the strains of the semiconductor crisis. In the aftermath of President Biden’s signing of the CHIPS and Science Act, we’ve been seeing news articles about Mexico positioning itself to take advantage of the US’s desire to bring semiconductor manufacturing closer to home. According to these reports, Mexico is starting to offer incentives to tempt semiconductor manufacturers to open facilities there. The country is already the eighth largest producer of electronics. It’s also close to where companies like Intel and Samsung are already planning new facilities. Many of these activities began before the chip crisis, with the onshoring efforts and the SHIP program we’ve talked about before on the podcast. Dr. Terrazas provides some insight on the microelectronics manufacturing capabilities in Mexico, and how the US can leverage these capabilities to bolster our domestic semiconductor supply chain. He also talks about the growing technical talent pool that can help solve some of the growing semiconductor workforce challenges.  Learn more CETYS University hereContact our Guest on LinkedInDr. Juan Terrazas Gaynor, Director of Engineering, CETYS University
20:16 09/08/2022
A Conversation with Beth Keser and James Haley about What’s Happening at the IMAPS International Symposium
 The IMAPS International Symposium takes place October 4-7, 2022 at the Hynes Auditorium in Boston MA.  This year's Symposium theme is Packaging Technologies Enabling the New Normal, and will feature 20 sessions in five technical tracks, plus an Interactive Poster Session. The technical program will span three days of sessions with an emphasis on packaging technologies that serve 5G, High-Performance Computations, Automotive, Industrial, Defense/Space, Medical electronics markets, and beyond.  New this year will be a workshop on Strategies to Revitalize the Onshore Packaging and Assembly Defense Industrial Base, a Workforce Development Panel discussion, and a DEI Townhall discussion and reception, Equity and Equality in the Workplace. In this episode, Françoise speaks with Beth Keser, President of IMAPS, and Jim Haley IMAPS VP of Marketing, who dive into the details of this year’s event.  To learn  more about the event or to register, visit the IMAPS Symposium Website Connect with our guests on LinkedIn Beth Keser James Haley
14:17 09/01/2022
A Conversation with Katy Crist and Tara Greig About the Roadtrip Nation Experience
Earlier this year, we brought you an episode about Roadtrip Nation – an initiative the SEMI Foundation sponsored to raise awareness among recent STEM graduates about opportunities in the semiconductor industry. We interviewed SEMI Foundation’s Shari Liss, to get all the details. You can listen to the episode here. In this follow-up episode, we’re speaking with TEL’s Katy Crist, who heads up the company’s workforce development initiative, and Tara Greig, an intern at TEL who was selected as one of the lucky candidates who participated in this year’s Roadtrip Nation.   Katy talks about the importance of the Roadtrip Nation project to SEMI’s image and awareness campaign about the semiconductor industry as a great career path. She also talks about TEL’s involvement. Two-thirds of the way through the experience, Tara shares some highlights of her experience and the journey from applying to the program through the actual three-week adventure, the people she met, the connections and relationships she made, and also provides tips for future applicants who might want to take advantage of this amazing program.Roadtrip Nation is a nonprofit organization that humanizes career exploration through storytelling and empowers individuals to connect their interests to fulfilling lives and careers.Learn more Find our Guests on LinkedINKaty Crist, Sr. Manager, Strategic Alliances and Partnerships, TELTara Greig, Business Informatics Intern, TELTEL Tokyo Electron (TEL) provides innovative semiconductor and flat panel display production equipment.
26:16 08/25/2022
A Conversation About the Role Veterans Can Play in the Microelectronics Industry Workforce
lThis podcast episode was recorded live at SEMICON West 2022 at the Moscone Center in San Francisco, where critical discussions about the latest issues impacting the semiconductor industry took place.  Chips aren’t the only thing in short supply, the semiconductor industry talent shortage continues, and SEMI has launched a workforce initiative to address this. In this episode, Françoise von Trapp speaks with General Paul Funk and Major Ray Willson of the United States Army; and Larry Smith, Chairman of the board at TEL, who participated in a panel discussion at SEMICON West on the role military veterans can play in shoring up the microelectronics workforce. All three guests share their Army stories, what it means to be a soldier for life, and about the important connections made there. They also talk about helping transitioning veterans from the military to civilian life, and what makes them so well suited for positions in microelectronics. Smith provides a recap of the SEMI panel, who participated, and some of the key takeaways. He talked about the semiconductor industry workforce image and awareness program, and how partnering with military veterans’ programs can form important connections that help veterans learn about the employment opportunities available to them.  General Funk talks about the lifelong connections that a career in the army allows affords, as well as the similarities of characteristics and skill sets that make veterans such ideal candidates for careers in the semiconductor industry. He describes some of the army programs that transition army veterans to civilian life. One of these programs is Soldier for Life.Major Ray Willson provides more details on Soldier for Life, which connects the army with government and non-government organizations to influence policies, programs, and services for soldiers veterans, and families. He explains the three pillars in detail.  Find our Guests on LinkedIn: Larry Smith, TEL U.S.General Paul Funk, U.S. ArmyMajor Ray Willson, U.S. ArmyTEL Tokyo Electron (TEL) provides innovative semiconductor and flat panel display production equipment.
25:20 08/18/2022
A Conversation with Laura Matz About Pioneering Secure Data Collaboration for Semiconductor Manufacturing
In this episode, Françoise von Trapp interviews Laura Matz, CEO of Athinia™ and Chief Science and Technology Officer of Merck KGaA, Darmstadt, Germany, about the growing need for data collaboration between materials suppliers and semiconductor device manufacturers, and the solution she helped create. Over the past 10 years, more new materials have been introduced into semiconductor manufacturing at each device node. At the same time, processes continue to tighten. This is increasing sensitivities to materials variations. Because of this, materials companies have to publicly communicate on excursions in the materials supply chain. Until now.  Matz explains how a secure data ecosystem platform can use Big Data and AI to solve these issues. She provides details on how this platform addresses both IP security and cybersecurity. The platform she describes, Athinia™, was launched in December 2021. This secure data collaboration platform allows semiconductor device manufacturers and materials suppliers to share, aggregate, and analyze data to unlock efficiencies and time to market while improving quality, supply chain, and sustainability.   Six months in, Matz has some exciting news to share about a collaboration with Micron. She also talks about her role in conceptualizing this platform and bringing it to life.  Athinia - Data for Pioneers Building a secure data ecosystem to solve some of the toughest semiconductor industry problems.
19:08 08/11/2022
A Conversation with Bruce Kim and Jin Choi about the Secondary Semiconductor Equipment Market
The secondary semiconductor equipment market has been under a strain as secondary tools have been in hot demand since the chip shortage began in 2020 impacting the entire semiconductor supply chain. Here to speak with Françoise about this are Bruce Kim and Jin Choi of SurplusGLOBAL. They are their company’s perspective, and the actions they are taking to address the situation.   Kim talks about the growth of the secondary equipment market in Korea, where the company is based. He explains that the chip shortage has not only placed a demand on new tools but secondary tools because of the need to increase the capacity of legacy node chips. He talks about challenges facing companies who want to expand capacity. The main issue is the long lead times for new tools, so customers are turning to secondary equipment. There are also challenges with finding parts for legacy tools.  To address these challenges, SurplusGLOBAL established its Semiconductor Equipment Cluster. Kim discusses the motivation for building it. He also talks about the company’s new global parts program to support customers around the world who struggle to find replacement parts for otherwise perfectly good tools that have years of life left in them.   Lastly, to support customers who need to optimize new processes but don’t have the spare lines to devote to them, they’ve launched an R&D Foundry program. Jin Choi leads this initiative and discusses it.  Kim wraps up our discussion by talking about the role secondary semiconductor equipment can play in creating a more sustainable semiconductor ecosystem. To learn more about SurplusGLOBAL visit the website. or contact Bruce Kim, CEO, SurplusGLOBAL on LinkedIn.  SurplusGLOBAL SurplusGLOBAL is one of the largest one-stop platforms for pre-owned semiconductor equipment.
20:05 08/04/2022
Member Spotlight: Conversations from SEMICON West 2022 and DAC 2022
In this episode, we visit 3D InCites member companies on the trade show floor at SEMICON West and the Design Automation Conference to learn about what they are showcasing this year. Dave Kirsch and Paul Lindner of EV Group talk about the latest achievement in die-to-wafer fusion and hybrid bonding, and what it means for multi-die system-on-chip.  They also share BIG news about 3D ICs.  Alan Weber, Cimetrix, a division of PDF Solutions, talked about the company’s connectivity and control products for automated fabs and the data pipeline its technology enables. Weber emphasized the use of streaming data to improve supply chain challenges.  Faraz Shoukat of Anemoi Software walks us through a demonstration if the company’s cloud-based thermal modeling tool for multichip modules, stacked die, and chiplet integration.  Monita Pau of Onto Innovation talks about the importance of particle inspection for hybrid bonding, and the focus on panel-level packaging. Byron Exarcos, CEO ClassOne Technology, talks about the company’s plating and surface preparation process capabilities to support hybrid bonding, especially for microLED applications. The company introduced a new Solstice platform at the show and Exarcos reports that the company is already gaining traction.  Meg Conkling, of Veeco, joins the podcast for the third time – and she and Françoise compare notes about the markets since SEMICON West 2021. They discuss the automotive industry, and their next vehicles. They also talk about advances is Veeco’s Laser Spike Annealing, lithography, and ion beam deposition product offerings.  Jim Garstka, PlasmaTherm, talks about the impact of the chip shortage, the company’s latest product introduction, the HeatPulse, used in automotive electronics, as well as the role plasma dicing takes in providing clean die surfaces for die-to-wafer hybrid bonding.  Vidya Vijay, CyberOptics, talks about the latest generation WaferSense technology used for wafer and reticle calibration for front-end tools. She also talked about some of the presentations she attended at SEMICON West, and what she’s excited about.  Alex Chow, and Sai Danraj of YES about the company’s recent shift in focus from wafer segments for backend processes to the IC carrier substrate segments of the industry. The products they showcased included the next generation Vertacure, as well as two new products that will be introduced on the market in the coming year: one is for solder reflow, and the other for glass panel substrates. Kiterocket A global strategic marketing agency serving the semiconductor and sustainability industries.SEMI A global association, SEMI represents the entire electronics manufacturing and design supply chain.
59:31 07/28/2022
Conversations with SEMI Leadership on Semiconductor Industry Challenges, Growth, Sustainability, and Workforce Development
This podcast episode was recorded live at SEMICON West 2022 at the Moscone Center in San Francisco, where critical discussions about the latest issues impacting the semiconductor industry took place.  Françoise von Trapp speaks with Joe Stockunas, the new President of SEMI Americas; Ajit Manocha, SEMI CEO and President; Mousumi Bhat, who heads up SEMI’s Sustainability Initiative, and Shari Liss, Executive Director at SEMI Foundation, who talk about some of the week’s highlights. While Joe is new to trade organizations, he brings over 40 years of industry experience in executive positions to this role. During the conversation, he talks about how his perspective as a long-time SEMI member gives him insight on how to serve the membership. He also shares highlights of SEMICON West 2022, and takeaways from the keynote talks. To wrap up his interview, Joe touches on future plans for SEMICON West, and his top priorities for SEMI programs for the Americas. With Sustainability as one of SEMI’s main priorities, there was an entire day and a half devoted to it, with the Sustainability Summit and Sustainability Start-Up event. The interview with Ajit Manocha and Mousumi Bhat focuses on the critical situation of climate change, and the role SEMI is playing to support industry-wide collaboration in setting achievable goals so that we can half our carbon footprint by 2030, and net zero by 2050. They also discuss next steps and top priorities for a Semiconductor Industry Sustainability Roadmap. Lastly, Françoise speaks with Shari Liss about SEMI’s new career platformed to help diversity and grow the U.S. semiconductor workforce. They talk about the microelectronics industry’s image and awareness program, and what SEMI Foundation is doing to address it. Shari unveils the details of the career platform, which is designed to help students understand what skills they have, which they need to develop, and how they can apply this skills to a career in the semiconductor industry.  Learn more about the Sustainability Initiative here Learn more about the Career Platform here Find our guests on LinkedIN:  Ajit Manocha, CEO and President, SEMI Joe Stokunas, Presideint, SEMI Americas Mousumi Bhat, VP, SEMI Sustainability Programs Shari Liss, Executive Director, SEMI Foundation 
46:05 07/21/2022
A Conversation about The Importance of Buildiing Trusted and Secure Microelectronics
Françoise von Trapp interviews Thomas Smelker, of Mercury Systems, about what is meant by “Trusted and Secure” microelectronics, and why it is critical to Mercury’s military, aerospace, space, and industrial customers.  He then does a deep dive into the geopolitical climate, the “actors” are trying to take away the technological advantage the US and its allies have. Tom explains why trusted and secure microelectronics are more important now than ever, as well as why it’s important to bring leading-edge 2.5D and 3D advanced packaging to its DoD customers. They discuss the impact of the supply chain issues on reshoring, procuring rare-earth minerals, and adhering to ESG efforts, as well as making sure their supply chain partners are trusted and secure.  The company just opened a new facility in Phoenix Arizona. Tom gives Françoise take a tour of the facility, and they take our listeners along to hear all about it.  As Tom walks us through the facility, the conversation shifts to chiplet integration, and the company's capabilities in these leading-edge technologies.   Photos of the original ribbon cutting can be found here on the 3D InCites website. Contact Tom Smelker on LinkedIN Learn more about Mercury Systems 
34:22 07/14/2022
Conversations from the 2022 IMAPS SiP Conference Part 2
ASE’s Mark Gerber, Amkor’s Curtis Zwenger, and Quorvo’s Matthew Poulton talk about 5G Technology Challenges; Synopsys' Ming Zhen talks about the Era of SysMoore; Start-up competition competitors give mini-pitches. While the rollout of 5G is underway, there are remaining technology challenges that must be solved before we can really experience the full benefits of 5G. This was the topic of for the panel discussion at the IMAPs SiP Conference. We invited the panelists to talk about it on the podcast: Mark Gerber from ASE, Curtis Zwenger of Amkor, and Matthew Poulton, Qorvo.We talked about the hype around the 5G that’s been deployed today, vs mmWave technology needed for new 5G. We also discussed the challenges for the advanced packaging community to develop the technologies needed to support the higher frequencies needed to support 5G. Questions asked and answered include: ·      Why are 5G download speeds no better than LTE today? ·      Is what we are experiencing in 5G really truly 5G? ·      What needs to happen for 5G to be ready for automotive applications? ·      Why do we experience more dropped calls on a 5G phone than LTE?  Ming Zhang, Synopsys, talks about his career path from his Ph.D. in rad-hard circuit design, to IC design at Intel, chiplet design at Z-Glue, to Synopsys. Traditionally a front-end EDA company, Synopsys began to invest in advanced packaging design just a few years ago. He also talks about the new era of “SysMoore”, focusing on three enabling capabilities and opportunities for design: software, system, and security. The goal is to show How to get better chips, done faster, used by more people and things, focusing on the quality of product, speed of innovation, and scale of deployment. Start-up Competition David Levy, Mosaic Microsystems, talks about the company’s novel ViaFirm, a material used for temporary bond/debonding of active glass wafers to silicon handle for processing. Merve Kecher, Sivers Semiconductors, talked about the technological advantages of the company's AIP module  how it solves some of the remaining 5G challenges. Haris Baset, Averatek, talked about the company's chemistries that unlock the full potential of lithography processes, photoresists, and dielectric materials. He also talks about the company’s SiliconDust authentication chiplet.  Chris Pfisner, Avacino Tech, explained that the start-up leverages blue micro LEDs as optical interconnects for short-reach, ultra power interconnects for chip-to-chip communications.  Guest Contacts Mark Gerber, ASE GlobalCurtis Zwenger, Amkor Technology Matthew Poulton, Qorvo Ming Zhang, Synopsys David Levy, Mosaic MicrosystemsMerve Kacar, Sivers Semiconductors Haris Baset, AveratekChris Pfisner, Avacina Tech
61:24 07/07/2022
Conversations from the 2022 IMAPS SiP Conference Part 1
Qualcomm’s Chidi Chidambaram talks about system technology co-optimization; ASE’s Mark Gerber Talks about the VIPack Platform; Daniel Graf, Zero EC, talks about solving data bottlenecks.This episode was recorded live at the 2022 IMAPS Advanced SiP Conference, where the focus is on SiP technology developments, solutions and business trends. The first interview is with keynote speaker, Chidi Chidambaram, Qualcomm, who talked about system-level optimization opportunities and challenges in the era of slowing silicon process technology. In this podcast interview, Chidambaram explained why Qualcomm is not at the forefront of 3D IC and has focused on SiP solutions. He shared some of the key takeaways from his talk and answered Françoise’s questions about what he calls the connected intelligent edge, and why that’s important for the microelectronics industry. He also discusses the company’s position on chiplet technologies, and why it will be some time before they consider it for mobile applications.  Mark Gerber unpacks ASE’s new platform, VIPack. He talks about the motivation behind the platform. The capabilities of its core technologies and target applications. He also discusses the company’s role in the Universal Chiplet Integration Express (UCIe) as an effort to develop standardization for interfaces. Daniel Graf, head of business development at Zero EC. The EC stands for Energy Connection. This start-up is an IP developer for semiconductor applications to solve data transport bottlenecks. He explains the challenges of data transfer, and how much energy is wasted during the process. Graf describes the solution his company has come up with to solve the issue. Guest ContactsChidi Chidambaram, QualcommMark Gerber, ASE GroupDaniel Graf, Zero ECKiterocket A global strategic marketing agency serving the semiconductor and sustainability industries.
47:17 06/30/2022
A Conversation With the SEMI Market Intelligence Team About the Equipment Market
We are excited to share that we’ve partnered with SEMI’s Market Intelligence team to bring you quarterly semiconductor industry market updates. Each episode will feature one of SEMI’s market analysts, who will discuss different market trends driving specific areas of the market. They’ll also provide some high-level intelligence to help you in your day-to-day business decisions. In this first episode, we’re focusing on the Semiconductor Manufacturing Equipment Market. Guests include Sanjay Malhotra, Vice President of Corporate Marketing and the Market Intelligence Team, and Inna Skvortsova, one of the Analysts in the Market Intelligence Group.  Sanjay kicks off the conversation by providing information on the SEMI Market Intelligence team. He talks about the value he gained as a customer of SEMI reports during his tenure at Applied Materials. He describes the different offerings, and explains who uses SEMI data, and how. Then, Inna dives into the reporting. She explains how the data is gathered, and how they ensure the reliability of the reports. In addition to providing some details on current year equipment market growth, she talks about the impact of the chip shortage on the equipment manufacturers, supply chain constraints, and other potential headwinds. You can learn more about SEMI Market Reports here.  Fo specific questions, email the Market Intelligence team at Find our Guests on LinkedIn: ·       Sanjay Malhotra, VP of Corporate Marketing and the Market Intelligence Team·       Inna Skvortsova, Market AnalystSEMI A global association, SEMI represents the entire electronics manufacturing and design supply chain.
21:54 06/23/2022
Conversations from the ECTC 2022 Technology Corner
Françoise hit Technology Corner at the IEEE Electronic Components Technology Conference 2022, May 31-June 3, interviewing 3D InCites member companies about being back in person, and their perspectives of some of the key industry challenges such as supply chain issues, sustainability; diversity, equity, and inclusion efforts, new technology advancements, and much more. Tanja Braun, Fraunhofer - IZM, accepted the 3D InCites Award and shared some of the results of the PLP consortium 2.0. We talked about the challenges of standardizing panel sizes, the progress made, and what’s next for a possible third-phase of development.  Diane Scheele, EMD, Ken Araujo, Namics; and Dean Payne, Indium all talk about the challenges materials suppliers in meeting sustainability requirements for semiconductor and microelectronics manufacturing.  John Park, Cadence, talks about how EDA tools for packaging have evolved from PCB based to chip design based. He also talked about the company’s new Thermal Solver tool, Celsius.  Patrick Parin, Micross, talks about the supply chain shortages, how it’s impacting the company, and the steps they are taking to anticipate and mitigate the situation. Robert Avila, Finetech, talks about the company’s new die bonding platform, Pico 2. He also talked about dealing with lead times and price increases as part of the supply chain shortage. Robin Davis, Deca, talks about the company’s Diversity Equity and Inclusion initiative that she leads, and what she likes about working there. Dick Otte, QP Technologies, talks about the progress, or lack thereof, of the Chips for America Act and which companies are likely to benefit from the funding. He also talks about the changing telecommunications market, and massive increase in data rates between 10 years ago and today. YES’s Zia Karim and Dragen Checic talked about a new partnership in Korea, and their new application lab coming soon in Chandler Arizona.Habib Hichri of Ajinomoto Fine Tech, winner of our Material Supplier of the Year award, talked about the company’s ABF film used in substrates and assured us that even though there is a substrate shortage, there is no shortage of ABF film.  Matt Phillips, of our newest community member, SET NA, shares the company’s back story, and talks about their Ontos plasma cleaning system. He talks about the impact of the supply chain on the lead times for their different tools. MST Group's Peter Putnam shares the process flow of product assembly through the partners companies, and talks about the impact of the supply chain and a new concept: design for supply chain.  Roland Rittenmeir, Evatec, talks about what he learned in attending the sessions. He also talked about the company’s role in chiplet integration.  
58:49 06/16/2022
Conversations about What We Learned from ECTC 2022
In Part 1 of ECTC 2022 coverage, Françoise catches up with some of the industry visionaries at key companies in the microelectronics space, as well as 3D technology research institutes to find out what they shared and learned at ECTC 2022. The episode kicks off with a conversation with Marvell’s Kevin O’Buckley who talked about key take-aways from the advanced packaging and co-packaged optics panel, and Chris Koopmans who shared some insight on the impact of supply chains on fabless semiconductor manufacturing, and how he thinks the $52B Chips Act funds should be allocated.  Paul Lindner, Dave Kirsch, and Thomas Uhrmann of EV Group talk about ECTC itself, and how much they enjoy reconnecting with colleagues after 2.5 years. They also talked about what they learned at ECTC 2022. Laura Mirkarimi and Abul Nuruzzaman of Adeia (formerly Xperi) and Alan Huffman, of SkyWater, talk about recent advancements in hybrid bonding. They also provide some details about the new licensing agreement between the companies.Sitaram Arkulgud, of TEL, shares some of the details of the presentations that TEL delivered on hybrid bonding. He explained the limits of chemical mechanical planarization, how they are explaining what to do when it runs out of steam, and how to keep hybrid bonding going when that happens. Subramanian (Subu) Iyer, of the UCLA CHIPS program, explains why he believes chiplets should be called dielets. Why chiplets aren’t where they need to be yet to match the performance of monolithic chips, and the work they are doing at UCLA to get there. As ECTC 2022 draws to a close, Françoise reminisces with IZM-ASSID’s Juergen Wolf, about 12 years of work in 3D integration technology. Françoise wraps up the day with a glass of wine with ASE Fellow, Bill Chen, who has been instrumental in progressing the Heterogeneous Integration Roadmap. He talks about its purpose, the committee’s vision, and it will make possible the next 50 years of Moore’s Law, as Gordon Moore himself envisioned in the second part of his paper. 
69:03 06/10/2022
A Conversation about Being an Entrepreneur in the Semiconductor Industry
The semiconductor industry is on a rapid growth trajectory, with a goal of becoming a $1 trillion industry by 2030 – that’s only 8 years away! Getting there will require a tremendous amount of innovation, investment, and risk-taking – all characteristics that define an entrepreneur. But what does it really mean to be an entrepreneur in the semiconductor industry? To find out, Françoise visited our 3D inCites community member, CyberOptics Corpation. The company’s president and CEO, Dr. Subodh Kulkarni, was recently named a finalist for the Ernst and Young Entrepreneur of The Year® 2022 Heartland Award. This is one of the preeminent competitive business awards for entrepreneurs and leaders of high-growth companies who think big to succeed. During the interview, Dr. Kulkarni talks about the importance of resiliency and never giving up.  He also explained his leadership approach at CyberOptics, and the importance of creating a family culture that fosters diversity and inclusivity.   Dr. Subodh Kulkarni  Kulkarni has been a director of CyberOptics Corporation since 2009 and has been the President and Chief Executive Officer since February 2014. He was the Executive Chairman from September 2013 to February 2014 and was the lead director from December 2012 until his election as Executive Chairman. From January 2013 to February 2014, he served as Chief Executive Officer of Prism Computational Sciences, a developer of software tools for scientific and commercial applications in the simulation of hot gases and plasmas used in the semiconductor industry. Prior to his work at Prism, he held various positions with Imation Corporation, including Chief Technology Officer; Senior Vice President, OEM/Emerging Business; and Vice President, Global Commercial Business, R&D, and Manufacturing. Prior to his employment with Imation, he held various research management positions with 3M Corporation and IBM. He currently serves on the Board of Directors of Key Tronic. He has won awards for commercializing technologies he and others have developed in the electronics industry. He holds a Master's Degree and a Ph.D. in Chemical Engineering from the Massachusetts Institute of Technology. He wrote his thesis on the surface decomposition of disilane, a chemical used to manufacture semiconductors.He received a B.S. in chemical engineering from IIT—Bombay, India (where he was first in his class). 
38:08 06/02/2022
A Conversation about The State of the Semiconductor Raw Materials Market
In our continued coverage of the chip shortage and actions being taken around the globe, this episode looks at the raw materials market, and how different aspects of it are impacting the semiconductor supply chain. Françoise speaks with Lewis Black, CEO of Almonty Industries, an international raw materials development company that mines tungsten – which is integral material in semiconductor chips and electronics. Tungsten gas used to create a nanolayer coating on the inner workings of semiconductor chips to make them dissipate heat better and run more efficiently. The conversation covers a lot of ground – how the shift to electric vehicles is increasing the need for semiconductor devices and how that impacts raw materials supply; the impact of the pandemic and the geopolitical situation; the US push to onshoring that is driving US domestic manufacturers to seek alternative choices to China and Russia for tungsten; as well as the importance of environmental social governance driving companies to more ethically sourced raw materials supplies. We also talk about the $52 billion expected to be dispersed once Congress passes the Chips for America Act.  About Lewis Black: Lewis Black is CEO of Almonty Industries, a leading global company involved in the mining, processing, and shipping of tungsten concentrate, and has over 15 years of experience in the tungsten mining industry. From June 2005 to December 2007, he was Chairman and CEO of Primary Metals Inc. (“PMI”), a former TSX-V-listed tungsten mining company. Black also formerly served as head of sales and marketing for SC Mining Tungsten, Thailand. In addition, Black is well-versed in the global rare earths market, the current supply chain for those rare earths, and what’s to come in diversifying the supply chain as demand continues to increase. Connect with Lewis Black on LinkedIn. Learn more about Almonty.  Kiterocket A global strategic marketing agency serving the semiconductor and sustainability industries.
25:42 05/19/2022
A Conversation about The Semiconductor Sustainability Challenge
The semiconductor industry’s role in creating a sustainable world continues to be one of the hottest topics of discussion. At the SEMI Industry Strategy Symposium 2022, almost every presentation addressed the issue in one form or another. In this episode, Françoise speaks with Marshall Chase, director of sustainability at Micron. Marshall’s entire presentation at ISS was on this topic. Topics of discussion include: ·      The feasibility of semiconductor companies reaching Net Zero Emission Goals by 2050, and ways that can be achieved. ·      Different approaches companies are taking·      The 17 Sustainable development goals, and how they apply to the semiconductor industry ·      The business advantages of establishing an Environmental Social Governance roadmap·      The role sustainability plays in attracting talent to the industry ·      The impact of the pandemic on semiconductor sustainability efforts ·      Micron’s approach and commitment to sustainability  Learn more about Micron’s Pact for Impact Contact Marshall Chase   Kiterocket A global strategic marketing agency serving the semiconductor and sustainability industries.SEMI A global association, SEMI represents the entire electronics manufacturing and design supply chain.
20:56 04/22/2022
A Conversation About the Ukraine War, the EU Chips Act, and the European Semiconductor Industry
SEMI Europe’s Laith Altimime joins Françoise for a conversation about how the Ukraine War is impacting Europe in general, and specifically the European semiconductor industry supply chain. Laith explains what SEMI is doing to support the semiconductor supply chain crisis. On a brighter note, they also talk about the outcome of the recent European Chips Act. Europe wants to go from owning 9% to 20% of the worlds chip manufacturing. The European Chips Act that was passed adds €15 billion to an existing €30 billion in public investments to create new STEM-focused programs, attract new talent to Europe, and build new infrastructure.Lastly, Laith invites everyone to learn more at the upcoming ISS Europe, which takes place in Brussels, Belgium, on May 30, 2022. Learn more and register here. Contact Laith Altimime Kiterocket A global strategic marketing agency serving the semiconductor and sustainability industries.SEMI A global association, SEMI represents the entire electronics manufacturing and design supply chain.
26:12 04/20/2022
SEMI ISS 2022: A Conversation about Creating a Risk-Ready Supply Chain
 As we all know, events of the last two years that are beyond our control – such as the pandemic, geopolitical issues, trade wars, and the war in Ukraine - have had a significant impact on the semiconductor supply chain, sending us scrambling for workarounds and playing catch-up. What if we had been better prepared to proactively address these issues? At SEMI ISS Bindiya Vakil, Co-founder and CEO of Resilinc, presented a talk titled, Designing Risk-Ready Supply Chains for the Post-COVID World. In this conversation, Bindiya talks about the power of mapping and real-time monitoring of potential disruptions to create a robust supply chain. She says mapping and monitoring allow you to proactively outline the worst-case situations, collaborate with your suppliers, take deliberate action and protect knowns based on available information. Contact Bindiya Vakil
22:35 04/18/2022
ISS 2022: An Unedited Conversation over Breakfast with the SemiSisters
What’s changed about ISS since 2020? The attendees were 20% women – and specifically, women in leadership. To celebrate, we gathered some of our SemiSisters for a conversation over breakfast and recorded it as a podcast episode. We talked about lots of things – what it’s like to be a woman in this male-dominated industry, our personal career journeys, and how we navigated the pandemic. We also talked about all the opportunities for women in engineering, and other STEM degrees, as well as non-STEM career paths; the benefits of mentorship; and more. The conversation meanders and goes off on tangents, and there is a LOT of laughter. This was so much fun to make. Here’s who participated. You can find them on LinkedIn.  Debbie Gustafson, CEO EnergetiqMeg Conkling, Director, Global Key Accounts Veeco Emerald Greig, Surplus Global Lubab Sheet-Davis, VP at Lam Research Corporation Cat Nylund, Director of Sales / Business Development, Rogue Valley Microdevices Nerissa Draeger, Ph.D, Director of Global University Engagements at Lam ResearchKiterocket A global strategic marketing agency serving the semiconductor and sustainability industries.SEMI A global association, SEMI represents the entire electronics manufacturing and design supply chain.
23:44 04/15/2022
A Conversation with Semiconductor Market Analysts about Reaching $1Trillion by 2030
We spent the week of April 4-8 at the SEMI Industry Strategy Symposium, where industry leaders gathered to discuss the key issues facing the semiconductor industry, and set goals for the next year – and beyond. In this episode, Françoise talks with some of the market analysts who presented their 2022 projections: Jan Vardaman, of TechSearch International, Andrea Lati of TechInsights, and Bob Johnson, of Gartner.  This conversation touches on all the key points that are currently top of mind for the semiconductor industry, from the impact of the inflation, the pandemic, the geopolitical situation, and the global economy to critical supply chain shortages, the talent shortage, and more. Questions include: ·       How will all of these headwinds impact 2022 projections? ·       Will the industry really reach $1T in revenue by 2030, and what happens if we don’t? ·       How should the $52B of the Chips Act Funding be allocated? ·       When will we start to see the results of Intel’s IDM 2.0? Contact the SpeakersJan Vardaman, TechSearch International Andrea Lati, TechInsightsBob Johnson, Gartner
20:38 04/13/2022
SEMI ISS 2022: A Conversation about The Ukrainian Neon Gas Shortage
 SEMI’s annual Industry Strategy Symposium (ISS) took place April 4-7, 2022 at the Riz Carlton resort in Half Moon Bay, CA. The event usually takes place in January, but due to Omicron, was postponed at the last minute and rescheduled to April. This annual event is where industry leaders gather for mission-critical discussions that the strategies for the year ahead. Over the course of the week, we recorded six episodes, speaking to presenters and attendees about the hottest topics in the semiconductor industry. In this first episode, Françoise speaks with Kristian Yerygin, Chief Commercial Officer of Recycling Solutions, Ukraine. Yerygin attended ISS representing Arnox, a strategic waste and byproduct management company that is part of a Ukrainian steel conglomerate, and supplier of Neon, Xenon, and Krypton. These rare gasses are critical for lithography processes used in semiconductor manufacturing. Yerygin explains in detail the impact of the Russian invasion of Ukraine, the toll it’s taking on the steel industry, and subsequently the supply of Neon, Xenon, and Krypton. He explains what it could mean for the semiconductor industry and what semiconductor manufacturers need to do to prepare for an inevitable shortage of these rare gasses. Contact Kristian Yerygin on LinkedIn.Kiterocket A global strategic marketing agency serving the semiconductor and sustainability industries.SEMI A global association, SEMI represents the entire electronics manufacturing and design supply chain.
20:40 04/08/2022
A Conversation about the New Vision for IMAPS
In 2021, there was a changing of the guard at the International Microelectronics and Packaging Society. In this episode, Françoise speaks with new IMAPS President, Beth Keser, and President-elect Erica Folk, about their vision for IMAPS going forward. Beth and Erica provide details on three major initiatives: One is to create awareness in the US Government and defense industry about the importance of packaging in the semiconductor industry. The second is to bring in more academics and students into the society. Students are the future of the microelectronics industry. Third, they want to update the IMAPS documentation to modernize the bylaws and rules that govern the organization. We also talked about the activities of the IMAPS Foundation. They are launching a competition to get universities excited. Learn more here. Contact our Speakers on LinkedIn·      Beth Keser, IMAPS President·      Erica Folk, IMAPS President-electIMAPS Device Packaging Conference Interconnects for Tomorrow’s Applications
14:16 03/31/2022
Members Spotlight: Conversations from IMAPS DPC 2022
In addition to our 3D InCites Award Winners, we caught up with some of our members who had news and stories to share at IMAPS DPC, March 8-10, 2022.  In this episode, Françoise speaks with Bob Connor, of member company X-Celeprint, about the Micro Transfer Process (MTP) a massively parallel pick and place technology that has been around since 2007, but is starting to get traction new applications in the heterogeneous integration space.  Next, she speaks with Darby Davis of Gel-Pak, a Delphon Company, who explains the relationship between Delphon Industries and its subsidiary companies. Gel-pak is a different sort of advanced packaging. While they aren’t involved in building microelectronics, they are critical to the supply chain as they are used for packaging and handling fragile devices. They come to IMAPS DPC to learn about what’s happening in the industry to stay on top of their technology development. The episode wraps up with a conversation with Abul Nuruzzaman, Xperi Corporation, in which they unpack the elements of a recent two-pronged press release about a new license agreement with Micron, and a new brand for the Xperi IP business – Aediea.Contact our Speakers on LinkedIn·      Bob Conner, VP Business Development, X-Celeprint·      Darby Davis, VP Sales, Delphon Industries·      Abul Nuruzzaman, VP Marketing, Xperi CorporationIMAPS Device Packaging Conference Interconnects for Tomorrow’s Applications
22:55 03/28/2022
A Conversation about The Status of US Onshoring and the DoD’s SHIP Program
The topic of the 2022 IMAPs Global Business Council Spring Meeting, co-located with the IMAPS Device Packaging Conference, was Onshoring for the Department of Defense (DoD). Since the last time we visited the Onshoring packaging to the US question, the Chips Act has been passed, and now Congress is trying to decide how to appropriate the 52Billion in incentives.  Simultaneously, the already-funded State-of-the-Art (SOTA) Heterogeneous Integrated Packaging (SHIP) program has been launched to develop a sustainable business and operational model to provide the DoD with access to domestic sources of SOTA digital and radio frequency packaging. It’s believed that sustained access to SOTA packaging will foster significant system performance increases, which will enable military system modernization and support next-generation capabilities.In this episode, we speak with Jim Will of Skywater Technology and John Lannon, of Micross AIT. Both presented as part of the GBC plenary session. We talk about how the $52Billion would best be appropriated. We also talk about the concerns that this might be just a temporary solution, and what the outcome will be if it’s not sustained.   We also speak with Keynote Speaker, Darrin Crum, Technical Lead of the SHIP Program, and Tom Smelker of Mercury Microsystems, the performer that provides the classified environment needed to keep the program secure. Crum and Smelker explain how the SHIP program works, who is involved, and how chiplets and other heterogeneous integration technologies can make it possible to quickly bring SOTA to the defense community. Contact Today's Speakers on LinkedIn: James Will, SkyWater Technology - A&D BU DirectorDr. John Lannon, Micross Advanced Interconnect Technology - General ManagerDarren J. Crum, Naval Surface Warfare Center, Crane Division - Technical Lead of the SHIP Program for OUSD(R&E) – Modernization MicroelectronicsTom Smelker, Mercury Systems – VP& GM, MicrosystemsTo learn more, read Tom Smelker's blog post, Enabling a Trusted Domestic Microelectronics Ecosystem. IMAPS Device Packaging Conference Interconnects for Tomorrow’s Applications
33:58 03/21/2022
Conversations with the 2022 3D InCites Award Winners – Part 1
We presented the 2022 3D InCites Awards in person on March 10 at the IMAPs Device Packaging Conference. Rather than acceptance speeches, we carved out time throughout the week to interview some winners for the 3D InCites podcast. In this, the first of two episodes we speak with the following award winners and asked them to share their success stories with our listeners. First up, a conversation with EMD’s Jeff Catlin, about the company’s commitment to sustainable semiconductor manufacturing. EMD is our 2022 Sustainablity Award Winner. Next, you’ll hear from John Lannon of Micross AIT, about the company’s legacy of 3D IC technology development. Micross is the 3D InCites Devices manufacturer of the year. Craig Bishop, CTO of Deca, Process of the Year winner, talks about Gen 2. of Adaptive Patterning. He also share’s his personal story of how he came to be part of the advanced packaging industry. It all began with a conversation with his neighbor, Tim Olson, CEO of Deca…Shelby Nelson, CTO of Mosaic Microsystems, winner of Start-up of the Year, share’s the company’s origin story as women-founded company, through its growth today.  ERS electronic GmbH is the 2022 Equipment Supplier of the Year, and Debbie Claire Sanchez joined us to talk about the highlights of the paper she presented on the company’s advances in thermal debonding. She also shared some of her back-story of working at Deca. This year’s Herb Reiter Design Tool Award went to Cadence. We spoke with John Park about the company’s first-of-its-kind comprehensive, high-capacity 3D-IC design platform. He also clarifies the difference between a SiP and a chiplet architecture from a design perspective. Raja Swaminathan gives an acceptance speech for the DEI Award, explains the role of a Sr. Fellow at AMD. He also talks about AMD’s 3D V-Cache, and explains what he means by True 3D. We continued the discussion of the different between a SiP package and a Chiplet package. IMAPS Device Packaging Conference Interconnects for Tomorrow’s Applications
60:25 03/17/2022
A Conversation about What's Happening at the IMAPS Device Packaging Conference
IMAPS Device Packaging Conference 2022 takes place next week – March 8-10, here in our home state of Arizona, and we at 3D InCites are very excited! It’s been two years since the event took place in person. In fact, it was the last event I attended before the world shut down – literally two weeks later. Even then, the buzz was about COVID 19, elbow bumping and hand sanitizing. Masks weren’t even a thing yet. It was also the last time we held the 3D InCites Awards Ceremony in person. Last year, we went virtual. So we thought it would be great to kick things off and generate some excitement by inviting Beth Keser, IMAPS new President, and Jim Haley, VP of Marketing, to talk about what’s in store for attendees. We talk about the programming, the exhibits, networking opportunities, the collaboration between 3D InCites and IMAPS to bring you future podcast episodes and more. Here's where you can learn more about what we discussed:  ·      IMAPS Device Packaging Conference Program and Registration ·      IMAPS Golf Outing ·      3D InCites Award Winners·      Hike for DEI Email Françoise for DEI Sponsorship information or to sponsor a podcast episode Beth Keser, Ph.D. is a recognized global leader in the semiconductor packaging industry with over 24 years of experience. She received her B.S. degree in Materials Science and Engineering from Cornell University and her Ph.D. from the University of Illinois at Urbana-Champaign. Beth’s excellence in developing revolutionary electronic packages for semiconductor devices has resulted in 34 patents and patents pending and over 50 publications in the semiconductor industry. Based in San Diego, Beth leads Intel’s Packaging & Systems Technology department in the Product Enablement Solutions Group.  Beth is currently IMAPS President and has taught a Professional Development Course on Fan-Out Wafer Level Packaging at conferences since 2015. Connect with Beth Keser on LinkedIn James Haley is a passionate leader with cross functional experience in early adoptive and fortune 100 companies.  Background and experience range in bridging businesses from start up to commercial success.  Active areas of expertise business strategy, strategic marketing, product development and strategic selling in prior companies.Mr. Haley received his Bachelor of Business Degree from St. Norbert College in Wisconsin.  He participates in several organizations relating to the electronics industry and is an active member in IMAPS, IPC and the USPAE.Connect with James Haley on LinkedIn IMAPS Device Packaging Conference Interconnects for Tomorrow’s Applications
23:31 03/03/2022
Conversation about The Chiplet Design Exchange
One of our most listened-to episodes in Season 1 was on the importance of package design for chiplet integration. For those of you who are new to this podcast and chiplet technology, in a nutshell: Chiplets are hardened blocks of IP of different semiconductor technology nodes that result from disaggregating – literally taking apart a System-on-Chip. These blocks are then reintegrated as a single package using high-speed interfaces to deliver greater performance at a reduced cost, higher yield, and lower power with only a slightly larger area than a heterogeneous integrated advanced package.Chiplets are big news right now for companies like Intel, AMD, and TSMC – but one of the challenges for broadening the market is the lack of standardized models. To address this, the Chiplet Design Exchange was created.   In this conversation, Françoise talks to Anthony (Tony) Mastroianni of Siemens EDA and Jawad Nasrullah Palo Alto Electron, Inc. to demystify all of this – especially for those who are not fluent in chip and package design.  You’ll get some back-story on the evolution of chiplets, and the importance of standardizing chiplet models and workflows for the chiplet ecosystem. You’ll also learn about the Chiplet Design Exchange, what the goal is, and how you can become involved.  Meet the SpeakersTony Mastroianni has more than 30 years of experience as an engineer and engineering manager in the global semiconductor industry. In recent years, he has focused significantly on advanced ASIC package design flow development (2.5/3D). He currently leads the development of Advanced Packaging Solutions for Siemens Digital Industries Software. Prior to joining Siemens, he served in engineering leadership positions at Inphi and eSilicon. He earned a bachelor’s degree in electrical engineering from Lehigh University and a master’s in electrical engineering at Rutgers University. Email Tony. Jawad Nasrullah is a chip designer with expertise in chiplets, microprocessors, HW/SW co-design, and SerDes. Previously Jawad was the co-founder and CTO of zGlue, Inc., a Silicon Valley chiplet startup that set the direction of chiplet technology and developed a number of heterogeneous integrated circuits. Jawad is now working on his next adventure, Palo Alto Electron. Jawad has been very active with the ODSA workgroup within OCP to help catalyze chiplet ecosystems. Before zGlue, Jawad has held leadership positions at Intel, Samsung, Sun Microsystems, and Transmeta. Jawad holds a Ph.D. degree in Electrical Engineering from Stanford University. Email JawadThe Chiplet Design Exchange is part of the Open Domain-Specific Architecture (ODSA) Sub-Project under the OCP Server Project. Learn more here.   
24:40 02/24/2022
A Conversation about SEMI Foundation and Roadtrip Nation
Workforce development is a critical and ongoing challenge in the microelectronics industry. SEMI Foundation is working to build awareness about the opportunities that come with a career in microelectronics through its Industry Image and Awareness Campaign. Part of that initiative is a partnership with Roadtrip Nation to create a video and documentary series focused on the microelectronics industry.  In this episode, I talk with Shari Liss, Executive Director of SEMI Foundation. She explains how for young people interested in STEM, the semiconductor is still fairly invisible.  They know all about social media apps, but they don’t understand the microelectronics that underpin all these devices. The goal of the Image and Awareness Campaign is to bring the semiconductor out of obscurity, so they can understand what opportunities are available to them.To this end, SEMI Foundation has partnered with the Council for Adult and Experiential Learning (CAEL)  and Roadtrip Nation to provide opportunities to students who are interested in learning more about this exciting industry.  Listen in to learn all about these programs and how your company can participate and support these efforts.  You can learn more about SEMI Foundation’s workforce development efforts here. If you’re interested in becoming involved in SEMI Foundation’s Road Trip Nation initiative, contact Shari Liss.   TEL Tokyo Electron (TEL) provides innovative semiconductor and flat panel display production equipment.
17:33 02/10/2022